Product guides and specifications

Thermal management

 
The range of applications where the use of a thermally conductive material is necessary has greatly increased as electronic circuits have become more complex and powerful.
  • Non-silicone pastes
  • Silicone pastes
  • RTV's
  • Epoxy
  • Accessories
  Non-silicone pastes
 
 
HTC
HTC
Non-silicone Heat Transfer Compound
HTCA
HTCA
Non-silicone Heat Transfer Compound Aerosol
HTCP
HTCP
Heat Transfer Compound Plus - Non Silicone
HTCPX
HTCPX
Non-Silicone Heat Transfer Compound PLUS Xtra
HTCPX_LV12.5K
HTCPX_LV12.5K
Non-Silicone Heat Transfer Plus - Low Viscosity
HTCX
HTCX
Heat Transfer Compound Xtra - Non Silicone
 
 
 
  Silicone pastes  
 
HTS
HTS
Silicone Heat Transfer Compound
HTSP
HTSP
Silicone Heat Transfer Compound Plus
 
 
  RTV's (Room Temperature Vulcanising)  
 
TCER
TCER
Thermally Conductive Ethoxy RTV
TCOR
TCOR
Thermally Conductive Oxime RTV
 
 
  Epoxy  
 
ER2074
ER2074
Epoxy Resin
ER2183
ER2183
Epoxy Resin
TBS
TBS
Thermal Bonding System
 
 
  Accessories  
 
TCRGUN
TCRGUN
Application Gun
 
  • Non-silicone pastes
  • Silicone pastes
  • RTV's
  • Epoxy
  • Accessories
 Electrolube - Thermal management
Most components have a maximum, effective operating temperature. Failure to maintain the temperature below this level can lead to a variation in electrical properties and overall increased failure rates.
Metal heat sinks are typically connected to components which generate a large amount of thermal energy when in use. These are used to dissipate such energy away from the device to avoid failure due to over-heating.
Heat sinks have proven to be very effective over the years however in order to ensure full contact and therefore maximum efficiency, thermal management products are used alongside.
 Electrolube - Thermal management
Metal surfaces, even when polished to a fine degree, have a certain amount of roughness. It can therefore be deduced that when two metal surfaces are placed together contact is not 100% and there will always be an air gap between the two surfaces.
The use of a thermal paste or adhesive allows such gaps to be filled ensuring complete contact between the two surfaces and in turn more efficient heat conductance.
The range of applications where the use of a thermally conductive material is necessary has greatly increased as electronic circuits have become more complex and powerful. These advances have resulted in greater heat generation. Solar panel systems (photovoltaics), is just one example where such heat must be drawn away from the components quickly and efficiently, ensuring long term reliability and operating efficiency.
The range of applications where the use of a thermally conductive material is necessary has greatly increased as electronic circuits have become more complex and powerful.